Yocto Linux Development & BSP Customization | IES
We customize Yocto Linux for your embedded product.
From BSP bring-up to production-ready systems. Our engineers bridge the gap between silicon and software with surgical precision.
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Cloud Layer
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Application Framework
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Yocto Build System
BitBake / Custom Layers
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Linux Kernel / Drivers
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Hardware / BSP
Common Yocto Linux Issues We Solve
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Build Errors
Resolving complex BitBake task failures and dependency hell in multi-layer environments.
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BSP Bring-up Failure
Debugging hardware-software handshake issues on custom silicon boards.
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Boot issues (U-Boot)
Correcting early-stage bootloader malfunctions and environmental variable corruption.
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Driver Integration
Porting and patching specialized drivers for kernel version mismatches.
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Yocto Layer Conflicts
Optimizing layer priorities and overriding messy upstream recipes safely.
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Long Build Times
Implementing sstate-cache and hash equivalence for accelerated CI/CD pipelines.
Yocto Linux Development Services
CORE SERVICE
Yocto BSP Customization
Professional board bring-up, custom layer architecture, and production hardening for any architecture (ARM, x86, RISC-V).
- check_circle Custom machine configurations
- check_circle Hardware-accelerated graphics layers
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Kernel & Driver Dev
Upstreaming patches, custom device drivers, and mainline kernel migration.
Expertise
PCIe
USB stack
DRM/KMS
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OTA Update Systems
Robust field updates using RAUC, Mender, or custom A/B schemes with rollback safety.
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Performance Optimization
Sub-second boot times and minimal footprint kernels for resource-constrained hardware.
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Bootloader Dev
Secure Boot configuration with TF-A (Trusted Firmware-A) and customized U-Boot scripting.
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Deep Yocto Expertise
Years of experience contributing to the Yocto Project and managing massive layer sets.
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Real Hardware Debugging
We don't just write code; we use oscilloscopes and JTAG to find the root cause.
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Production-Ready Systems
Security hardening and industrial-grade stability benchmarks included in every build.
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Engineer-to-Engineer
Direct access to lead developers. No middleman, no translation layers.
Proven Results
How we solved complex engineering hurdles for our clients.
CASE STUDY 01
STM32MP1 BSP Bring-up
Problem
Customer hardware failing to boot due to incorrect DDR timing and clock configurations in early boot stages.
Solution
IES engineers audited the TF-A and U-Boot initialization code, correcting memory controller registers for the custom RAM modules.
Result
100% Boot success rate across 500 prototype units; reduced boot time by 4 seconds.
The Deployment Path
1
Audit & Plan
Initial review of hardware specs and current Yocto configuration to identify bottlenecks.
2
Layer Dev
Developing clean, modular custom layers following the OpenEmbedded best practices.
3
Verification
Rigorous automated testing on real target hardware for stability and performance.
4
Handoff
Full knowledge transfer, training for your team, and long-term maintenance support.
Field Proven Solutions
Real problems solved for our global clients.
STM32 Ecosystem
STM32MP1 NAND Boot Fix
Issue
Unreliable cold boot from NAND flash in extreme temperatures.
Solution
Optimized FSBL timing and ECC parameter configuration in U-Boot.
Result
100% Boot Reliability across -40°C to +85°C.
Automotive
CAN Driver (TCAN4550)
Issue
High latency in SPI-to-CAN FD message handling on Linux.
Solution
Developed custom kernel driver with interrupt-driven RX queuing.
Result
40% reduction in packet latency, zero drop rate.
Linux Ops
Yocto Build Optimization
Issue
6-hour full image build time causing development bottlenecks.
Solution
Implemented sstate-cache mirroring and CI/CD parallelization.
Result
Incremental builds reduced to 12 minutes.
Need help with your Yocto Linux build?
Stop fighting BitBake errors and start shipping products. Our team of specialists is ready to take your BSP to the next level.
